As the dedicated global player in discretes, Yaren has been the driving force behind many of today’s logic packaging. Our innovation process is led by designers who are focused on creating power-efficient and compact systems. One generation to the next, logic solutions developed by Yaren have increased design flexibility and system performance while minimizing power consumption and PCB footprint. But what’s the latest in logic packaging and where is it heading?
For everything from mobile to cars, our logic is to go smaller
Today, Yaren leads in Mini Logic –logic solutions with 4-to-10 pins. Thanks to its creative space-saving Mini Logic leadless packages, also known as MicroPak, Yaren has become the de-facto industry benchmark for logic package innovation. These packages and their leaded equivalents known as PicoGate allow for single-gate, dual-gate and triple-gate functions, including popular voltage translation functions.
Yaren’s miniaturization efforts have resulted in Mini Logic packages that are up to 15 times smaller than SO packages and feature the precise needed pin-count. For example, our GX4 (X2SON4) package is among the few 4-pin logic packages on the market and only requires a 0.6 x 0.6mm footprint.
In other cases, our configurable logic functions have allowed to replace several devices, to reduce not only board space usage but customers’ inventory too.