How to solve the warpage issue of PCB board?

   date:2020-10-27     browse:7    comments:0    
Summary:Warpage in the manufacture of printed circuit boards can cause inaccurate positioning of components; when the board is bent in SMT and THT, the components are not properly inserted, which will bring difficulties to assembly and installation work.

Warpage in the manufacture of printed circuit boards can cause inaccurate positioning of components; when the board is bent in SMT and THT, the components are not properly inserted, which will bring difficulties to PCB assembly and installation work.

 

IPC-6012, SMB--SMT printed circuit board maximum warp or distortion of 0.75%, other board warp generally does not exceed 1.5%; electronic assembly plant allowed warp (double / multi-layer) is usually 0.70 ---0.75%, (1.6mm plate thickness) In fact, many boards such as SMB, BGA board requires warp less than 0.5%; some PCB manufacturers even less than 0.3%; 


 

Warpage calculation method = warpage height / curved length

 

Prevention of PCB board warpage:

 

1、Engineering design: the inter-layer prepreg arrangement should correspond; the multi-layer core board and prepreg should use the same supplier product; the outer C/S surface area should be as close as possible, and a separate grid can be used;

2、Drying before baking: generally 150 degrees 6-10 hours, remove the water vapor inside the plate, further cure the resin completely, eliminate the stress inside the plate; bake the plate before opening, whether it is inside or both sides!

3、Warp and weft shrinkage ratio is different,pay attention to the warp and weft direction before laminating the sheet;when the core board is blanked, attention should also be paid to the warp and weft direction; the direction of the solidified sheet coil is the warp direction; the long direction of the copper clad plate is the warp direction.

4、Laminating thick to relieve stress, cold pressing after pressing plate, trimming raw edges.

5、Boiler before drilling: 150 degrees 4 hours.

6、The thin plate is preferably not mechanically brushed, it is recommended to use chemical cleaning; special fixture is used for plating to prevent the board from bending and folding.

7、After the tin is sprayed, it is naturally cooled to room temperature on a flat marble or steel plate or the air floating bed is cooled and cleaned;

 

Warping plate treatment: 150 degrees or hot pressing for 3-6 hours, using a smooth and smooth steel plate, 2-3 times baking.

 

 

 


 
Article Source: How to solve the warpage issue of PCB board?
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