What are the differences between traditional face-up and flip chip LED COB packaging technologies?
Features of GTLED flip chip COB packaging:
Comparing with standard face-up LED packaging technology, wire bonding has been avoided in GTLED flip chip packaging technology, thus no risk of gold wire breakage.
Comparing with standard flip chip packaging technology, eutectic bonding between LED chip and substrate in GTLED flip chip packaging technology result in excellent thermal conductivity for this whole device.
Why small light emitting surface (LES)?
● Easier optical design: smaller LES means easier secondary optical design, makes more compact and portable light fixture realizable.
● High Power & Lumen density achieved
● Makes beam light more focused that travels farther.FC10-60
| Product Image | Product Type | LES (mm) | CCT (K) | CRI | φ (lm） | Power (W) | VF (V) | IF (A) | Chip Array |
 | GT-FC15X3-1.0 | 2.6*2.6 | 8000-8500 | 70 | 1000-1500 | 15 | 12-14 | 1.2 | SP0401 |
 | GT-FC20X3-1.0 | 2.9*2.9 | 8000-8500 | 70 | 1500-1800 | 20 | 12-14 | 1.5 | SP0401 |
 | GT-FC40X3-1.0 | 4.3*4.3 | 8000-8500 | 70 | 3000-3500 | 40 | 12-14 | 3 | SP0404 |
 | GT-FC60X3-1.0-2020 | 4.3*4.3 | 8000-8500 | 70 | 4000-4500 | 60 | 12-14 | 4 | SP0404 |
FC60-300
| Product Image | Product Type | LES (mm) | CCT (K) | CRI | φ (lm) | Power (W) | VF (V) | IF (A) | Chip Array |
 | GT-FC60X3-1.1 | 6.66*6.66 | 8000-8500 | 70 | 4500-5000 | 60 | 15-19 | 3.75 | SP0505 |
 | GT-FC90X3-1.1 | 6.66*6.66 | 8000-8500 | 70 | 6300-7200 | 90 | 15-19 | 5.5 | SP0505 |
 | GT-FC150X3-1.1 | 9.64*9.64 | 8000-8500 | 70 | 10000-12000 | 150 | 21-25 | 6.7 | SP0707 |
 | GT-FC300X3-1.1 | 13.48*13.48 | 8000-8500 | 70 | 20000-22000 | 300 | 30-36 | 10 | SP1010 |
PST10-600
| Product Type | LES (mm) | CCT (K) | CRI | φ (lm) | Power (W) | VF (V) | IF (A) | Chip Array |
| GT-PST30X3-1.0 | 2*2 | 8000-8500 | 70 | 2000-2500 | 30 | 12-14 | 2.5 | SP0401 |
| GT-PST60X3-2.0 | 3*3 | 8000-8500 | 70 | 4000-4500 | 60 | 12-14 | 5 | SP0401 |
| GT-PST80X3-1.0 | 4*4 | 8000-8500 | 70 | 5000-5500 | 80 | 12-14 | 6 | SP0401 |
| Product Type | LES (mm) | CCT (K) | CRI | φ (lm) | Power (W) | VF (V) | IF (A) | Chip Array |
| GT-PST120X3-1.0-4036 | 7.2*7.2 | 8000-8500 | 70 | 9000-10000 | 120 | 12-16 | 8 | SP0406 |
| GT-PST120X3-2.0-2728 | 5.45*5.45 | 8000-8500 | 70 | 9000-10000 | 120 | 21-25 | 4 | SP0701 |
| GT-PST300X3-2.0 | 10.4*10.4 | 8000-8500 | 70 | 24000-28000 | 300 | 36-42 | 7 | SP1202 |
| GT-PST600X3-1.0 | 14.5*14.5 | 8000-8500 | 70 | 40000-45000 | 600 | 36-42 | 7.5*2 | SP1202*2 |
| GT-PSTWW600-1.0 | 14.5*14.5 | 3200 | 70 | 17000-20000 | 600 | 36-42 | 7.5*2 | SP1202*2 |
| 5600 | 19000-22000 |